Thermal Interface Material (TIM Series) |
TIM series is effective in lower the thermal resistance between heat source and heat sink. The Thermal Pad use silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material.
Used for high power and high wattage electronics, for example Electric Vehicles, 5G technology, Autopilot System, Mobile Phone, AIoT, HPC (High Performance Computing), Server, IC, CPU, MOSFET, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, Memory Module, etc.
|
Property |
TIM-017 |
TIM-040 |
TIM-070 |
Test Method |
Thermal Conductivity |
1.7 W/mK |
4.0 W/mK |
7.0 W/mK |
ASTM D5470 |
Color |
Purple | Blue | Pink |
Visual |
Thickness |
0.25~25.0 mm |
0.3~7.0 mm |
0.3~3.0 mm |
ASTM D374 |
Hardness |
15±5 (Shore A) |
6±2 (Shore A) |
9±2 (Shore A) |
ASTM D2240 |
Density |
1.8±0.2 g/cm3 |
2.44±0.2 g/cm3 |
3.24±0.2 g/cm3 |
ASTM D792 |
Breakdown Voltage |
>6.0 KV |
15 KV |
16 KV |
ASTM D149 |
Volume Resistivity |
>1013 Ω.cm |
>1013 Ω.cm |
>1013 Ω.cm |
ASTM D257 |
Elongation |
75±10 % |
130 % |
50±10 % |
ASTM D412 |
Tensile Strength |
7±3 Kgf/cm2 |
1.0 Kgf/cm2 |
1.6 Kgf/cm2 |
ASTM D412 |
Working Temperature |
-45~+200 °C |
-45~+160 °C |
-50~+200 °C |
– |
Property |
TIM-090 |
TIM-120 |
Test Method |
Thermal Conductivity |
9.0 W/mK |
12.0 W/mK |
ASTM D5470 |
Color |
Pink | Gray |
Visual |
Thickness |
1.0~10.0 mm |
0.5~3.0 mm |
ASTM D374 |
Hardness |
40 (Shore 00) |
10±2 (Shore A) |
ASTM D2240 |
Density |
3.28 g/cm3 |
3.45±0.2 g/cm3 |
ASTM D792 |
Breakdown Voltage |
>5.0 KV |
16 KV |
ASTM D149 |
Volume Resistivity |
>1012 Ω.cm |
>1013 Ω.cm |
ASTM D257 |
Elongation |
- |
30±5 % |
ASTM D412 |
Tensile Strength |
- |
0.7 Kgf/cm2 |
ASTM D412 |
Working Temperature |
-40~+150 °C |
-50~+200 °C |
– |
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