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Thermal Interface Material (TIM Series) 

  

   

TIM series is effective in lower the thermal resistance between heat source and heat sink. The Thermal Pad use silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material.

 

Used for high power and high wattage electronics, for example Electric Vehicles, 5G technology, Autopilot System, Mobile Phone, AIoT, HPC (High Performance Computing), Server, IC, CPU, MOSFET, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, Memory Module, etc.

  

 

  

  

     

  

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Property

TIM-017

TIM-040

TIM-070

Test Method

Thermal Conductivity

1.7 W/mK

4.0 W/mK

7.0 W/mK

ASTM D5470

Color

Purple Blue Pink

Visual

Thickness

0.25~25.0 mm

0.3~7.0 mm

0.3~3.0 mm

ASTM D374

Hardness

15±5 (Shore A)

6±2 (Shore A)

9±2 (Shore A)

ASTM D2240

Density

1.8±0.2 g/cm3

2.44±0.2 g/cm3

3.24±0.2 g/cm3

ASTM D792

Breakdown Voltage

>6.0 KV

15 KV

16 KV

ASTM D149

Volume Resistivity

>1013 Ω.cm

>1013 Ω.cm

>1013 Ω.cm

ASTM D257

Elongation

75±10 %

130 %

50±10 %

ASTM D412

Tensile Strength

7±3 Kgf/cm2

1.0 Kgf/cm2

1.6 Kgf/cm2

ASTM D412

Working Temperature

-45~+200 °C

-45~+160 °C

-50~+200 °C

  

  

Property

TIM-090

TIM-120

Test Method

Thermal Conductivity

9.0 W/mK

12.0 W/mK

ASTM D5470

Color

Pink Gray

Visual

Thickness

1.0~10.0 mm

0.5~3.0 mm

ASTM D374

Hardness

40 (Shore 00)

10±2 (Shore A)

ASTM D2240

Density

3.28 g/cm3

3.45±0.2 g/cm3

ASTM D792

Breakdown Voltage

>5.0 KV

16 KV

ASTM D149

Volume Resistivity

>1012 Ω.cm

>1013 Ω.cm

ASTM D257

Elongation

-

30±5 %

ASTM D412

Tensile Strength

-

0.7 Kgf/cm2

ASTM D412

Working Temperature

-40~+150 °C

-50~+200 °C

      

   

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